TE Connectivity acquires pressure sensor business of Elmos

Silicon Microstructures acquired by TE Connectivity
TE Connectivity is expanding its sensor offerings by agreeing to acquire Silicon Microstructures Inc. (SMI), a supplier of MEMS-based pressure sensors, from Elmos Semiconductor AG. (Silicon Microstructures Inc.)

Measurement Specialties Inc., a subsidiary of TE Connectivity, has agreed to acquire Silicon Microstructures Inc. (SMI) from Elmos Semiconductor AG. Final terms of the deal were not disclosed.

Silicon Microstructures has a line of low and medium MEMS-based pressure sensors in digital and analog versions. The acquisition will enable TE to expand its global presence in pressure sensors, particularly in medical, transportation, and industrial applications. The deal is expected to merge SMI’s expertise in micro-electro-mechanical systems (MEMS) sensor technology design and manufacturing capabilities, with TE’s operational scale, customer base and existing sensors technologies into a more comprehensive global sensing solutions offering.

“Silicon Microstructures’ MEMS pressure sensing design and manufacturing capability is utilized in various applications requiring miniature design and high-performance packaging," said John Mitchell, senior vice president and general manager of TE's Sensor Solutions business unit, in a statement. “The MEMS low pressure sensing capability compliments TE’s pressure offering while strategically aligning to its market and application focus.”

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The deal enables Elmos Semiconductor, which has owned SMI since 2001, to concentrate on further developing its semiconductor core business around sensor ICs, motor control ICs, interface ICs, and power management ICs. The focus will be on expanding market share with innovative, differentiating solutions, especially for the automotive sector.

The acquisition is the second sensors-related deal for TE Connectivity this year. TE connectivity acquired First Sensor AG in June in a stock transaction.

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