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substrate fabrication

engineer in substrate packaging Gang Duian
Electronics

Intel names its inventor of 2024, Gang Duan

An engineer in substrate packaging, Duan has nearly 500 patents. His honor comes as Intel is undergoing a $10 billion cost-cutting plan.
Matt Hamblen Nov 18, 2024 11:40am
shows 3 dimensions

Effort to beef up electronics assembly faces Congress

Oct 30, 2024 8:00am

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