Tsinghau Unigroup to produce DRAM in China by Matt Hamblen Wednesday, July 3, 2019 A Chinese government backed company, Tsinghua Unigroup, will be building computer memory at plants in China.
Evaluation Kit Supports NXP Crossover Processor by Mathew Dirjish Monday, March 25, 2019 Flash memory eases creation of cost-sensitive applications.
Unique NVMs Consume 70% Lower Power Than Flash by Mathew Dirjish Tuesday, March 5, 2019 Ultra-low-power devices make next-generation smart IoT products a reality.
Memory Designer Shortens Design Cycles by Mathew Dirjish Tuesday, January 29, 2019 PathWave advanced design system solution reduces project delays.
Memory Card Logs In As Market’s Fastest by Mathew Dirjish Wednesday, December 12, 2018 Apacer's CFexpress card takes a quantum leap in performance.
Industrial-Grade eSIM Embarks In Miniaturized Package by Mathew Dirjish Wednesday, December 12, 2018 Infineon ships world's first industrial-grade eSIM in a compact package.
DDR4 Memory Runs Fast And Cool by Mathew Dirjish Monday, November 19, 2018 Wide temperature DRAM meets performance requirements of outermost edge-computing devices.
Collaborators Spin An Embedded MRAM Solution by Mathew Dirjish Monday, November 12, 2018 In the AI/IoT era, industry needs high-speed, area-efficient non-volatile memory.
3D NAND Architecture Rockets I/O Performance by Mathew Dirjish Tuesday, August 7, 2018 Xtacking boasts unprecedented NAND I/O performance, higher bit density, and faster time-to-market.
Partners Launch Multi-Project Wafer Service With Integrated Silicon OXRAM by Mathew Dirjish Thursday, August 2, 2018 Oxide-based resistive RAM platform for backend memories to offer non-volatility associated with embedded designs.
