SAN JOSE, CA -- Toshiba America Electronic Components, Inc. launches latest addition to its line of Bluetooth® Low Energy (BLE) communication ICs. The TC35667WBG-006 adopts Bluetooth Core Specification v4.1, enabling its use with scatternet[1] devices, and is well suited for Bluetooth Smart[2] applications including wearable sport and lifestyle products, remote controls, smartphone accessories, and devices for the Internet of Things (IoT).
The Bluetooth Core specification for version 4.0 and higher defines two standard scatternet functions. Adopted devices have to support either multiple or simultaneous connections with master and slave devices, or multiple connections between two or more master devices at the same time. Toshiba's new IC supports both functions with BLE, simplifying creation of a network with very small devices.
The TC35667WBG-006's combination of functionality and compact size – wafer chip-scale package (WCSP) dimensions are just 2.88mm x 3.04mm x 0.3mm high – makes it well suited to equip a BLE communication network in low-profile applications such as contactless cards, tags and tickets.
Compatible with voltages of 1.8V to 3.6V and temperatures of -40 to +85 degrees C, the new IC operates with current consumptions down to 5.9 milliamps and has a deep sleep mode that, when activated, reduces current consumption to just 0.5 microamp. On-board functionality includes DC/DC converter, low-dropout regulator, general-purpose ADC, and pulse-width modulation. User program function and a wake-up signal for a host device are also available.
For more details, go to http://www.toshiba.com/taec