SiP Wi-Fi Module Sports A Trim Profile

Heralded as the world's smallest Wi-Fi Silicon-in-package (SiP) module, the LTP0201 is designed for IoT and wearable devices that can connect to other smart devices or directly connect to the Internet for cloud-based data analytics and enhanced services. Measuring 6 mm x 6 mm, the module integrates a MCU, memory, power management, and RF parts. It includes a low power 32-bit RISC MCU, on-chip SRAM and internal SPI NOR Flash, and can be applied in a host-less or hosted mode where it connects to an 8/16/32-bit MCU through UART/SPI, or SDIO interfaces. It also can be used with sensors and other specific application devices through its GPIOs. The LTP0201 supports 802.11 b/g/n with integrated TCP/IP protocol stack, and supports 1x1 MIMO; the time of waking up to transmit packets is within 2ms, and the standby power consumption is less than 1.0mW in DTIM3 low power mode. For security, it integrates WEP, TKIP, AES, and WAPI HW secure engines.

Shenzhen Longsys Electronics Co.,Ltd
Shenzhen, China
+86-755-8616 8848
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http://www.longsys.com/en/products