Next-Gen Dual-Mode Bluetooth Audio Devices Deliver Superior Sound Quality

CHANDLER, AZ -- Microchip Technology Inc. announces the next generation of dual-mode Bluetooth audio products. The IS206X family builds on Microchip's successful IS202X portfolio of highly integrated system-on-a-chip (SoC) devices and modules by introducing Bluetooth Low Energy (BLE) capability. Uniquely engineered for speakers, headsets and gaming headphones, this Flash-based platform offers ample flexibility and powerful design features, allowing audio manufacturers to easily incorporate wireless connectivity in streaming music and voice command applications.

A high-performance 32-bit Digital Signal Processing (DSP) core provides the framework to develop sophisticated algorithms for advanced audio and voice processing. The 24-bit digital audio support delivers high-resolution audio to consumers for a richer listening experience. Sound systems comprised of multiple Bluetooth speakers benefit from ultra-low latency audio streaming, resulting in tightly synchronized audio playback amongst each speaker. Applications such as professional headsets benefit from high definition voice, achieved with a robust implementation of 16 kHz wideband voice with noise suppression and echo cancellation. The added firmware update capability allows for product software and configuration features enhancements over time.

Qualified for Bluetooth v4.2, the IS206X family supports Enhanced Data Rate (EDR) links and the standard audio profiles. The powerful combination of BLE and Advanced Audio Distribution Profile (A2DP) enables smartphone-to-speaker communication via a mobile app. Customized apps enrich the consumer's experience by providing creative control features such as pairing, remote control and real-time audio effect adjustments.

The IS206X family is available in several offerings, allowing customers to tailor their wireless needs. For designs that require a turn-key solution for fast time-to-market, customers can take advantage of the chip's powerful features by choosing a module configuration with either a Class 1 or a Class 2 device. All modules are fully certified with the following regulatory bodies: United States (FCC) and Canada (IC), European Economic Area (CE), Korea (KCC), Taiwan (NCC) and Japan (MIC).

Pricing and Availability

The following devices are available in volume production with pricing in 10,000 unit quantities:
•IS2062GM, 7 x 7 LGA package, starting at $4.72 each
•IS2063GM, 8 x 8 LGA package, starting at $4.97 each
•IS2064GM, 8 x 8 LGA package, starting at $5.08 each
•BM62SPKA1MC2-0001AA, an unshielded, Class 2 module starting at $7.09 each.
•BM62SPKS1MC2-0001AA, a shielded, Class 2 module starting at $7.27 each
•BM63SPKA1MGA-0001AC, an unshielded, Class 2 module starting at $7.28 each
•BM64SPKA1MC2-0001AA, an unshielded, Class 2 module starting at $7.42 each
•BM64SPKS1MC2-0001AA, a shielded, Class 2 module starting at $7.65 each
•BM64SPKA1MC1-0001AA, an unshielded, Class 1 module starting at $9.50 each
•BM64SPKS1MC1-0001AA, a shielded, Class 1 module starting at $9.63 each

To learn, visit http://www.microchip.com/IS206X_Bluetooth2149
 

Suggested Articles

Intel has come to the fork in the road, but will it take it?

OmniVision has developed reportedly the smallest image sensor on the market and has packaged it into a tiny wafer-level camera module.

Zoox wants a robo-taxi of its own design with no internal controls