Remtec applies its leadless ceramic SMT substrate technology to the development of a line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids. The packages address demands of the photonics industry for an SMT packaging solution as a viable alternative to standard TO-type packages. As a result, standard economical surface-mount packages can be produced for a wide range of circuits and I/O configurations fully compatible with most of JEDEC TO-style window caps such as TO-8, TO-46 and beyond at operating frequencies up to 10 GHz and higher. This approach promises to reduce design cycles, minimize tooling and engineering costs, and reduce end user assembly costs. For more info, visit http://remtec.com/remtec-products-services/leadless-ceramic-smt-substrates-packages-and-components
Leadless Ceramic SMT Packages Provide Alternative To TO Types
Company: Remtec Inc.
Country: United States (USA)