SAN JOSE, CA /PRNewswire/ -- Toshiba America Electronic Components Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, announces the "industry's thinnest CMOS image sensor camera module with high-resolution, 13 mega pixel imaging ideal for next-generation, ultra-thin smartphones and tablet devices. The new TCM9930MD leverages an advanced image pre-processing LSI (companion) chip and a refined module structure to create a compact image sensor camera module with the "industry's lowest profile" at just 4.7 mm in height.
Achieving today's high-resolution CMOS image sensors requires a larger optical size for corresponding lenses that results in a thicker camera module and a bulkier mobile device. The conventional method for lowering the camera module height is to modify the optical lens design, which becomes problematic due to resolution drop around the corners of the image area. The TCM9930MD, however, resolves this drop in resolution with the use of the image pre-processing LSI (companion) chip that provides distortion correction and performs image resolution reconstruction. Additionally, the TCM9930MD achieves its low profile by using a flip-chip structure for the image sensor. Toshiba opted to use flip-chip packaging because it allows for a large number of interconnects, with shorter distances than wire, which greatly reduces assembling area and package height.
"Toshiba once again proves its technical expertise in the development of this ultra-low height module, enabling customers to create the thin, attractive mobile products that consumers have come to expect," says Andrew Burt, Vice President of the Analog and Imaging Business Unit, System LSI Group at TAEC. "Our strategy of continuous innovation and enhancement to the TAEC systems offering, especially for the camera/imaging markets, provides the technology solutions that will drive thinner mobile devices without compromising picture quality or performance."
Pricing and Availability
Sample pricing for the TCM9930MD camera module is set at $80 (U.S.). The TCM9930MD is expected to be available in sample quantities by May 2013.
About TAEC
Through proven commitment, lasting relationships, and advanced, reliable electronic components, Toshiba America Electronic Components Inc. (TAEC) enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors, and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives, hard disk drives, discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers, and wireless components that make possible today's leading smartphones, tablets, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions, and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America Inc., a subsidiary of Toshiba Corp., Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 WW Semiconductor Preliminary Revenue Ranking, December, 2012). Toshiba Corp. was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide.