Siemens, Arm partner on IP, processes for vehicles

Electric vehicle
Siemens will partner with Arm to speed integration of IP, methodologies, processes and tools to help automakers, integrators and suppliers collaborate on the design of next-generation vehicle platforms. (Pixabay)

Siemens Digital Industries Software will partner with global semiconductor IP leader Arm, in a move to speed integration of IP, methodologies, processes and tools to help automakers, integrators and suppliers collaborate on the design of next-generation vehicle platforms. The partnership will in particular address the challenges of developing platforms to realize active-safety, advanced driver assistance, in-vehicle infotainment, digital cockpits, vehicle-to-vehicle/vehicle-to-infrastructure and self-driving vehicles.

Siemens' PAVE360 digital twin environment, featuring Arm IP, applies high-fidelity modeling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates. Using Arm IP, including Arm Automotive Enhanced (AE) products with functional safety support, digital twin models can run entire software stacks providing early metrics of power and performance while operating in the context of a high-fidelity model of the vehicle and its environment, helping deliver a new future of mobility.   

"Developing future transportation solutions requires collaboration across complex ecosystems," said Dipti Vachani, senior vice president and general manager, Automotive and IoT Line of Business, Arm, in a statement. "Arm technology has been deployed in applications across the whole vehicle for more than two decades, and our collaboration with Siemens redefines what is possible in terms of safety-capable, scalable heterogeneous compute. We see this as an important catalyst for the next wave of automotive semiconductor innovation."

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Using Siemens' PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs and better understand how they perform within a vehicle design from the silicon level up, long before the vehicle is built. By rethinking IC design for the automotive industry, manufacturers can consolidate electronic control units (ECUs), reducing the number of circuit boards and meters of wire within the vehicle design. This in turn reduces vehicle weight which can promote longer range electric vehicles.

Siemens' PAVE360 platform is being demonstrated in the Siemens Mobility booth at the Computer Electronics Show (CES) in Las Vegas, January 7 – 10, 2020. This demonstration will showcase Arm's automotive IP and technology from Siemens including Simcenter Prescan software, the Veloce hardware emulator, and Simcenter Amesim software.

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