SDK Simplifies IIoT Connectivity

Honeywell Process Solutions unveils the Matrikon FLEX OPC Unified Architecture (OPC UA) Software Development Kit (SDK). The company calls it the first robust, fully scalable SDK that simplifies the interconnection of industrial software systems, enabling them to communicate with each other regardless of platform, operating system. or size. The SDK is suitable for applications where minimal memory and processing resources are common.


Matrikon FLEX is heralded as the first high-performance developer toolkit that quickly and easily enables any Industrial Internet of Things (IIoT) application, regardless of size, with OPC UA. Growing adoption of the IIoT and Industrie 4.0 is driving requirements for open and secure connectivity between devices (e.g., machine-to-machine or M2M) and edge-to-cloud solutions. Since OPC UA serves as a key data connectivity standard, vendors are seeking to enable their new and existing products with this technology to compete in the IIoT/Industrie 4.0 landscape. 

Free Monthly Newsletter

Compelling read? Subscribe to FierceEmbeddedTech!

The embedded tech sector runs the market’s trends. FierceEmbeddedTech subscribers rely on our suite of newsletters as their must-read source for the latest news, developments and analysis impacting their world. Sign up today to get news and updates delivered to your inbox and read on the go.

Watch a video demo at For more details, go to

Suggested Articles

Two economic studies on expanding tech jobs to dozens of heartland places in the U.S. provoke a discussion on good work, good life.

Analysts predict 5G shipments to explode in number in 2020

Based on research by two MIT economists, Khanna’s multibillion-dollar plans foresees land-grant approach to tech education and tech hubs