Partners Develop AI 3D Developer Kit

VIA Technologies is partnering with AI vision startup Lucid, to deliver AI-based depth sensing capabilities to more dual- and multi-camera devices in the security, retail, robotics and autonomous vehicle space. With Lucid’s proprietary 3D Fusion Technology embedded into the VIA Edge AI 3D Developer Kit, security and retail cameras, robots, drones, and autonomous vehicles will now be able to capture accurate depth and 3D with dual- or multi-camera setups while reducing costs and power and space consumption.

 

The AI-enhanced 3D/depth solution developed by Lucid, known as 3D Fusion Technology, is currently deployed in devices such as 3D cameras, security cameras, robots, and mobile phones, including the RED Hydrogen One. In the VIA Edge AI 3D Developer Kit, the AI depth solution runs on the Qualcomm APQ8096SG embedded processor, which features the Qualcomm AI Engine along with support for multiple cameras.

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Smart cameras with depth sensing capabilities have become critical for applications in the security, retail, robotics and IOT industries, with applications such as more refined facial identification accuracy to determine distances between people in the space beyond glass walls and precise object recognition, tracking and measurements. For robots, drones and autonomous vehicles, depth sensing has dramatically improved the capability to navigate, save and reconstruct spaces in 3D, providing more autonomy for machines.

 

The VIA Edge AI 3D Developer Kit will be distributed to customers for evaluation and is available in limited quantities now with volume production beginning in 2019. For more information, visit Lucid and VIA Technologies.

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