ALISO VIEJO, CA -- Microsemi Corporation is the recipient of the 2016 Electronic and Software Technologies Network (ESTnet) Innovative Product or Software Application Award for its MiniSIM ZL70323, a miniaturized radio module for implantable medical devices. Recognized by Wales-based ESTnet during a recent award ceremony, the winning application was based on Microsemi's embedded die technology, which was leveraged to produce the unique new radio module.
The MiniSIM concept has reduced the size of implantable radio modules by 70 percent. The size reduction has been achieved through an embedded die, a unique innovation that places the die inside the printed circuit board (PCB) and under other components to produce a module that is 5.5mm x 4.5mm x 1.5mm. This minute module can be directly soldered to a mother PCB using its surface mount solder pads. In addition to standard implantable radio modules like the MiniSIM ZL70323, Microsemi also offers package miniaturization services.
The ESTnet Award judges recognized Microsemi for demonstrating increased business opportunities directly affected by the company's development of its MiniSIM device. It was also acknowledged for its evidence of innovative technology, as well as research and development successes including time-to-market.
Now in its fourth year, the annual ESTnet Awards celebrate excellence in Wales' electronics and software technologies sector. The Microsemi team was recognized during a ceremony held March 2 at the Wales Millennium Centre in Cardiff, UK, where more than 350 guests from the technology industry and related sectors were in attendance.