Leti research institute of CEA Tech and Mapper Lithography, provider of maskless lithography equipment, have developed what they describe as a low-cost cyber-security breakthrough that encrypts individual chips with a code. The non-falsifiable code is generated with direct multi-beam writing in a process that fits in a conventional CMOS flow with an extra level of lithography and without photomasks. Throughput on Mapper’s FLX-1200 tool is compatible with optical systems. The markets for these chips include data security, traceability, and combatting imports of counterfeit chips.
The two companies presented a paper on the breakthrough, “Process development of a maskless N40 via level for security application with multi-beam lithography”, at SPIE Advanced Lithography 2018 in San Jose, Calif. The paper demonstrates a via patterning integration that is compliant with standard CMOS 40nm process flow.
The maskless lithography system, based on massively parallel electron-beam writing capability developed by Mapper, is designed for high-volume specialty chips and low-volume advanced logic. Leti and Mapper are demonstrating the breakthrough for their customers at Leti’s facility in Grenoble. For more insights, visit Mapper and Leti.