Mont-Saint-Guibert, Belgium and Syracuse, NY, USA – CISSOID and M.S. Kennedy have signed a long-term collaboration agreement to develop high-reliability (HiRel) and high-temperature electronic modules. The agreement brings together Cissoid’s 14 years of experience in developing semiconductors that operate in extreme temperatures and harsh environments -- with M.S. Kennedy’s 43 years of expertise in developing complex high-quality and high-reliability multichip module solutions. Collaboration between the companies will address packaging multiple ICs into new, integrated, and highly compact standard multi-chip module products. Products introduced jointly will address new, high-temperature applications enabling customers to quickly develop their own solutions and reduce time to market.
Cissoid and M.S. Kennedy will shortly announce the details of their first jointly developed standard product based on Cissoid’s HADES® V2 -- a high-reliability, high voltage, and isolated gate driver solution that will provide a fully integrated solution to its customers. Both companies are also cooperating on custom modules, tailored to specific customer requirements.
“M.S. Kennedy is very excited to be working with Cissoid on developing next generation ultra high temperature products,” said Bill Polinsky, Business Development Manager at M.S. Kennedy. “We see this relationship as key to pushing high-temperature, multi-chip module functionality beyond 232°C”
Dave Hutton, VP of Worldwide Sales at Cissoid, added that “Cissoid is very excited about this collaboration. We are working very closely with many market leaders in the oil and gas, aerospace, industrial and automotive markets. As we talk to our customers, we see an increasing requirement for more integrated solutions to address key application areas. The collaboration with M.S. Kennedy will allow us to bring together our combined expertise and excellence into solutions that addresses those market needs”.