According to the report "Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022", published by MarketsandMarkets™, the market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022. The growth of this market is mainly driven by the rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of advanced wafer level packaging technologies in MEMS and sensors.
- Through-silicon Vias (TSVs) held the largest size of the interposer and fan-out WLP market in 2015
- The market for memory applications to grow at the highest rate between 2016 and 2022
- APAC accounted for the largest share of the interposer and fan-out WLP market in 2015
The major players operating in the interposer and fan-out WLP market include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), ASE Group (Taiwan), Amkor Technology (U.S.), Qualcomm Incorporated (U.S.), Texas Instruments (U.S.), United Microelectronics Corp. (Taiwan), STMicroelectronics NV (Switzerland), Broadcom Ltd. (Singapore), Intel Corporation. (U.S.), Jiangsu Changing Electronics Technology Co., Ltd. (China), and Infineon Technologies AG (Germany).
Browse 25 market data Tables and 42 Figures spread through 172 Pages and in-depth TOC on "Interposer and Fan-Out WLP Market" at http://www.marketsandmarkets.com/Market-Reports/interposer-fan-out-wlp-market-130599842.html
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