AUSTIN, TX -- In its latest teardown report, ABI Research discerns that the Intel Atom x3 Platform, the company's second integrated communication platform, includes the highest integration mobile platform transceiver to date. Code-named "SoFIA," the platform series' implemented innovation demonstrates the company's departure from the norm in taking integration down a new, differentiated path. The typical partition today is a connectivity IC, a transceiver, a power management IC and a modem/application processor IC. Intel's approach combines the first three into a single IC, leaving only the modem/application processor IC required to complete the system.
Though the Atom x3 series is getting a lot of attention this year, the real first launch of this partition occurred in 2014. The X-GOLD 632 platform, which included the A-GOLD 610 transceiver, the predecessor of the A-GOLD 620, launched in select phones last year. The marked differentiator between the two Intel generations is the addition of Wi-Fi and GPS to the A-GOLD 620. The A-GOLD 610 already contained the 2G/3G transceiver, BT and PMU.
"Intel was able to add all the functionality to the transceiver with very minimal impact to the package size when compared to the prior generation A-GOLD 610," says Jim Mielke, Vice President of Teardowns at ABI Research. "It is worth noting, however, that the internal die grew significantly, nearly doubling in size."
According to ABI Research's teardown findings, the Intel A-GOLD 620 is a 2G/3G transceiver that not only handles the normal 2G and 3G cellular radio demands, but also includes fully integrated Wi-Fi, Bluetooth 4.0 LE, FMR, GPS and GLONASS connectivity along with the platform audio and PMU functions.
Like the A-GOLD 610, which only requires the X-GOLD 632 modem/application processor to complete the platform, the A-GOLD 620 needs only the Atom x3-C3130 (SoFIA 3G, dual core apps/modem) or Atom x3-C3230 (SoFIA 3GR-quad core apps/modem) to be complete.
These findings are part of ABI Research's Teardowns, which include high-resolution photos and x-rays, pinpoint power measurements, detailed parts lists and block diagrams.
Read ABI Research's Connectivity: Intel Takes Integration Down a New Path teardown report:
For more information, visit http://www.abiresearch.com