Infineon Technologies AG and Qualcomm Technologies Inc. have teamed to develop a reference design for 3D authentication based on the Qualcomm Snapdragon 865 Mobile Platform. The collaboration extends Infineon’s application portfolio of 3D sensor technology for mobile devices.
The reference design uses the REAL3 3D Time-of-Flight (ToF) sensor and enables a standardized, cost-effective and easy-to-design integration for smartphone manufacturers. At CES 2020 in Las Vegas, Infineon introduced reportedly the world’s smallest (4.4 mm x 5.1 mm) 3D image sensor with VGA resolution. The sensor meets stringent requirements for face authentication, enhanced photo features and authentic augmented reality experiences.
"Today, the smartphone is more than just an information medium; it is increasingly taking over security and entertainment functions," said Infineon's Andreas Urschitz, Division President Power Management & Multimarket. "3D sensors enable new uses and additional applications such as secured authentication or payment by facial recognition. We continue to focus on this market and have clear growth targets. The collaboration with Qualcomm Technologies on reference designs using REAL3 image sensors underscores the potential and our ambitions in this area."
Starting this month, Infineon's REAL3 ToF sensor will enable the video bokeh function for the first time in a 5G-capable smartphone for optimal image effects even in moving images. Using the precise 3D point cloud algorithm and software, the received 3D image data is processed for the application.
The 3D image sensor captures 940 nm infrared light reflected from the user and the scanned objects. It also uses high-level data processing to achieve accurate depth measurements. The patented SBI (Suppression of Background Illumination) technology offers a wide dynamic measuring range for any lighting situation, from bright sunlight to dimly lit rooms.