Industrial-Grade eSIM Embarks In Miniaturized Package

Infineon Technologies has launched what is calling the world's first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). The company believes manufacturers of industrial machines and equipment ranging from vending machines to remote sensors to asset trackers can optimize the design of their IoT devices without compromising on security and quality.

 

Providing robust quality on a miniature footprint that works even under the harshest conditions remains a challenge for chip makers. Infineon's SLM 97 security controller in a Wafer Level Chip Scale Package (WLCSP) measures 2.5 mm x 2.7 mm, specifies an operating temperature range of -40°C to +105°C, and provides a feature set fully compliant with the latest GSMA specifications for eSIM.

Fierce AI Week

Register today for Fierce AI Week - a free virtual event | August 10-12

Advances in AI and Machine Learning are adding an unprecedented level of intelligence to everything through capabilities such as speech processing and image & facial recognition. An essential event for design engineers and AI professionals, Engineering AI sessions during Fierce AI Week explore some of the most innovative real-world applications today, the technological advances that are accelerating adoption of AI and Machine Learning, and what the future holds for this game-changing technology.

 

The chip in WLCSP is available in volume quantities now. For more information, SLM97 datasheets are available.

Read more on

Suggested Articles

Survey of 30 chipmakers offers a good sign for research and development of self-driving vehicles, analyst says

Research dollars for AV are expected to remain, if slowed, especially for companies that see self-driving as a key to their success

Hydrogen refueling stations are limited in the U.S., restricting interest in use of fuel cell electric cars