ST. FLORIAN, Austria, /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)—Taiwan's largest and one of the world's leading high-tech R&D institutions-in the development of advanced manufacturing processes for next-generation MEMS devices. As part of the collaboration, ITRI has purchased an EVG510 semi-automated wafer bonding system and an EVG6200 automated mask alignment system with top-bottom alignment and bond alignment options. EVG will also work closely with ITRI to develop, optimize and customize ITRI's wafer-level bonding processes for its partners and customers.
The new EVG systems will be installed at ITRI's Micro Systems Technology Center. There, they will join multiple EVG mask aligners and wafer bonders already installed and in operation at the research center for wafer-level anodic, eutectic and metal thermo compression bonding—which are critical steps in the production of MEMS devices. The EVG510 bonder will play a key role in supporting ITRI's transition to 200-mm MEMS wafer processing. ITRI also cited the high degree of flexibility of EVG's equipment, as well as the company's strong process support capabilities, as important criteria in their decision to purchase the new systems.
"At ITRI's Micro Systems Technology Center, our mission is to create innovative applications and develop interdisciplinary technologies that will drive continued growth in the MEMS industry," stated Tzong-Che Ho, Center Director of ITRI's Micro Systems Technology Center. "We are pleased to be working with EV Group—a recognized leader in MEMS manufacturing equipment and process expertise—to develop new processes that will enhance the competitive edge of our partners and customers."
According to market research firm IHS Suppli (El Segundo, CA), the MEMS market is set to enjoy double-digit growth from 2012 through 2014, with market revenue rising to $10.81 billion in 2014, up from $5.97 billion in 2009. Key drivers for market growth include the use of accelerometers, gyroscopes, pressure sensors and other MEMS devices for automotive and consumer mobile communications applications. Taiwan is a key hub when it comes to the production of these devices.
"ITRI has played a pivotal role in maintaining Taiwan's position as a center of innovation and excellence in the field of microelectronics," stated Dr. Viorel Dragoi, chief scientist at EV Group. "We look forward to continuing our long-standing relationship with ITRI, and leveraging our industry-leading technology and process expertise to support their MEMS process development and pilot production services."
Wafer-level aligned bonding is a key enabling technology for MEMS manufacturing due to the need to protect the miniature and fragile mechanical devices as the wafer goes through the remainder of the manufacturing process. Wafer-level bonding is required to create a zero-level package in order to hermetically seal and encapsulate the device. EVG's wafer bonding systems are designed for high-volume manufacturing with modular configurations for easy transfer of R&D processes to production. With the highest yields for aligned wafer bonding in the industry, EVG is a long-established premier provider of wafer bonding, alignment and handling equipment to the MEMS industry, working with 29 of the world's top 30 MEMS manufacturers.
ITRI is an international applied technology research organization. It aims to act as a breakthrough pioneer, helping Taiwan's manufacturing industry to value creation and also contributing to Taiwan's overall economic success. Since it was established from 1973, it has nurtured more than 70 CEOs, 162 innovative companies, and accumulated more than 10,000 patents. The mission of ITRI's more than 5,000 elite staff is to research and develop key technologies, stimulate and drive industrial development, generate economic value, and elevate social well-being for Taiwan.
In a world that is ever changing, ITRI's core value of "Innovation, Integrity, Sharing" has never changed. We will continue to make every effort to focus on the fields of Information and Communications; Electronics and Optoelectronics; Material, Chemical and Nanotechnology; Medical device and Biomedical; Mechanical and Systems; and Green Energy and Environment. ITRI engages in technological innovation with an imaginative and bold approach, engrossing in technology innovation, hoping to play the role as the world's leading research institute, the trail-blazing pioneer in industry. We will move forward together with the industry, heading towards a sustainable future!
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's unique Triple-i approach (invent - innovate - implement) is supported by a vertical integration, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.