Embedded Vision Development Kit Eyes Mobile Apps On The Edge

Lattice Semiconductor’s Embedded Vision Development Kit embarks as the first-of-a-kind development kit optimized for mobile-influenced system designs that require flexible, low cost, and low power image processing architectures. Leveraging a mix of Lattice’s FPGA, ASSP and programmable ASSP (pASSP) products in a single, modular platform, the kit provides the right balance of flexibility and energy efficiency required for a variety of embedded vision applications in the industrial, automotive and consumer markets. Combining the CrossLink pASSP mobile bridging device, ECP5 low power, small form factor FPGA, along with its high-bandwidth, high resolution HDMI ASSP, it accelerates development of intelligent, vision-enabled devices at the edge.

 

The CrossLink input board includes dual-camera HD image sensors supporting the MIPI CSI-2 interface, eliminating the need for external video sources. The ECP5 base board enables low-power pre/post processing and includes support for HD image signal processing (ISP) intellectual property (IP) from Helion Vision. Also included is a NanoVesta connector to support external image sensor video inputs. The HDMI output board based on the Sil1136 non-HDCP version enables connectivity to standard HDMI displays.

Free Monthly Newsletter

Compelling read? Subscribe to FierceEmbeddedTech!

The embedded tech sector runs the market’s trends. FierceEmbeddedTech subscribers rely on our suite of newsletters as their must-read source for the latest news, developments and analysis impacting their world. Sign up today to get news and updates delivered to your inbox and read on the go.

 

To learn more, visit http://www.latticesemi.com/evdkit?pr050117

Suggested Articles

Based on research by two MIT economists, Khanna’s multibillion-dollar plans foresees land-grant approach to tech education and tech hubs

Semtech chips to power gateways and sensors on ships serviced by Wilhelmsen of Norway

Smartglass products to appear in 2021 that include MEMS mirrors, sensors and more