The company expands its direct bond copper (DBC) product offerings by adding copper-filled vias, copper-coated bore holes, solder masks, and assembly options. Solder mask options include liquid photo image-able LPI for higher resolution patterns, higher operating temperatures to +400ºC, and elevated reflectivity mask for high luminance requirements typical for LED applications. Assembly options include flying leads and pin/lug attachments onto metallized ceramics using copper-silver alloy brazing and gold tin soldering. Also available are a wide variety of DBC products on alumina and aluminum nitride with many versatile copper finish options including selective gold tin to ensure excellent solderability, wire bondability, and product reliability.
DBC Products Add Numerous Options
Company: Remtec Inc.
Country: United States (USA)