GRENOBLE, France -- CEA-Leti, a recognized leader in 3D integration R&D, will significantly expand its technology offering this month when it ramps up one of Europe's first 300 mm lines dedicated to 3D-integration applications. By adding this technology to its existing 300mm CMOS R&D line, Leti now can offer heterogeneous integration technologies to customers on both 200 mm and 300 mm wafers.
The new line, dedicated to R&D and prototyping, includes 3D-oriented lithography, deep etching, dielectric deposition, metallization, wet etching and packaging tools that will be available for Leti's customers and partners around the world.
It will allow Leti to apply its 3D-integration generic processes on 300 mm wafers. This 3D toolbox includes a large portfolio of through-silicon vias (TSVs), and advanced capabilities in alignment, bonding, thinning, and interconnects in specific integration schemes for manufacturing optimized die stacks and building efficient advanced-systems solutions. This will be done in close collaboration with local design and characterization platforms.
"This extension offers important new capabilities to equipment manufacturers and other Leti partners," said Laurent Malier, CEO of Leti. "Together we will demonstrate 3D and heterogeneous integration technologies on 300 mm wafers."
About CEA-Leti
CEA is a French research and technology public organization, with activities in four main areas: energy, information technologies, healthcare technologies and defense and security. Within CEA, the Laboratory for Electronics & Information Technology (CEA-Leti) works with companies in order to increase their competitiveness through technological innovation and transfers. CEA-Leti is focused on micro and nanotechnologies and their applications, from wireless devices and systems, to biology and healthcare or photonics. Nanoelectronics and microsystems (MEMS) are at the core of its activities. As a major player in MINATEC campus, CEA-Leti operates 8,000 m2 state-of-the-art clean rooms, on 24/7 mode, on 200 mm and 300 mm wafer standards. With 1,200 employees, CEA-Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies. Strongly committed to the creation of value for the industry, CEA-Leti puts a strong emphasis on intellectual property and owns more than 1,500 patent families.