OmniVision Technologies, Inc., has raised the ante in vehicle imaging systems with its 1.3-megapixel OX01F10 SoC module. The module, contained in a single, ¼-in. optical format package, integrates a 3.0-micron image sensor and an advanced image signal processor (ISP). According to the company, the part solves the automotive rear-view camera (RVC) and surround view system (SVS) challenges of achieving a small form factor with low-light performance, ultra-low power and reduced cost, while improving reliability by using only one printed circuit board (PCB).
“Analysts predict that SVS and RVC will continue to hold the majority share in the automotive camera market, with over 50% of the total market volume through 2023. SVS, in particular, is expected to double its growth between now and 2023 due to increased customer adoption,” said Andy Hanvey, director of automotive marketing at OmniVision, in a statement. “Our OX01F10 SoC provides the best option for automotive designers responding to this growing consumer demand for better RVCs, along with the expansion of SVS into the mainstream market. Additionally, this SOC’s functional safety features allow module providers to create a single platform for both the viewing cameras and the machine vision applications that require ASIL B.”
OmniVision uses dual conversion gain (DCG) technology in the SoC to achieve a high dynamic range of 120 dB with only two captures, as opposed to three required by the competition, which minimizes motion artifacts while reducing power consumption and boosting low-light performance. Its integrated ISP further enables superior image quality with a number of advanced features, such as lens chromatic aberration correction, advanced noise reduction and local tone mapping, and optimization for the on-chip image sensor’s PureCel Plus technology.
PureCel provides a SNR1 of 0.19 lux. This enables the SoC to achieve high performance in challenging lighting conditions, enabling the ability to eliminate unnatural halos from LEDs and to provide better contrast on bright days.
The OX01F10 consumes under 300 mW typical, which is reportedly 30% lower than competitors and significantly reduces temperature. No metal heat sink is needed, thus allowing for the use of plastic camera module bodies to reduce costs. The module also enables smaller cameras that can fit in much tighter spaces.
The SoC provides 1.3-megapixel resolution and a 1340 x 1020 array size at 30 fps, which offers ample resolution for calibration. It also enables output flexibility with both two-lane MIPI and 10-bit DVP interfaces.