Renesas Electronics announced four new 32-bit microcontrollers (MCUs) that are supplied in ultra-small 64-pin ball grid array (BGA) and low-profile quad flat package (LQFP) designs.
They are designed for enhanced security for use in endpoint devices that employ compact sensor and communication modules in various settings such as industrial, building automation, smart meters and other uses at the IoT edge, Renesas said in a statement.
The 64-bit BGA RX651 MCU package drops the footprint size by 59% compared to the 100-pin land grid array, coming in a 4.5 x 4.5 mm. There is also a 64-pin LQFP that is 49% smaller than the 100-pin LQFP. It measures 10 x 10 mm. For both the BGA and LQFP there are two models available, either 1 MB of flash memory or 2 MB, for a total of four new microcontrollers.
Resensas said that explosive growth of IoT and Industry 4.0 technologies have sparked the need for smaller form factors with higher performance that provide security.
The 64-pin MCUs are based on a high-performance RXv2 core and 40 nm process for performance and strong power efficiency. The dual bank flash memory allows Back Ground Operation and SWAP, to make it easy for manufacturers to conduct firmware updates in the file securely.
They are optimized for connected industrial environments by monitoring the operating state of machinery from inside and outside the factory, which allows operations managers to change production instructions and reprogram MCU memory for updated settings.
The RX651 64-pin MCUs are available now, priced at $4.58 in 10,000 unit quantities.