Intel introduced a new x86 processor microarchitecture called Tremont for use in low-power devices, IoT, 5G networking and efficient data center products.
Tremont offers greater Instructions Per Cycle (IPC) than previous x86 architectures and will be used with Lakefield silicon for innovative machines like the recently introduced dual screen Microsoft Surface Neo, which hits the market late next year. It will feature two 9-inch screens with a 360-degree hinge and opens to a full size 13-inch display.
Tremont also relies on Intel’s 3D chip packaging technology called Foveros. Lakefield and Foveros were first unveiled at CES in February.
In a statement, Intel said Tremont is an example of an architecture that is the foundation for chips that capture and process data. A low-power chip built on Tremont will be essential to small form factor devices.
Tremont improves performance with a unique 6-wide out-of-order decoder in the front end, which allows for a more efficient feed to a wider back end.
“We focused on a range of modern, complex workloads, while considering networking, client, browser and battery so that we could raise performance across the board,” said Stephen Robinson, Intel’s Tremont chief architect, in a statement.
The announcement came at Linley Group's Fall Processor Conference in Santa Clara, California, just prior to Intel’s third quarter earnings call to be held after market close.