Vision System Exploits Intel Quad-Core Architecture

Teledyne DALSA’s GEVA 400 is described as a compact, low-cost vision system for multi-camera applications. Featuring the latest Intel quad-core ATOM architecture, four Power-over-Ethernet (PoE) compliant Gigabit camera ports are compatible with a wide range of cameras, including the company’s Genie Nano GigE. Adding cameras is said to be easy with commercially available network technologies, allowing for large configurations at much lower system costs. The system can be expanded with an optional PL-USB companion module that offers I/O expansion and integration for up to four GigE cameras.

, reliable and cost-effective solution for manufacturers across all industry segments.”

 

Free Newsletter

Like this article? Subscribe to FierceSensors!

The sensors industry is constantly changing as innovation runs the market’s trends. FierceSensors subscribers rely on our suite of newsletters as their must-read source for the latest news, developments and analysis impacting their world. Register today to get sensors news and updates delivered right to your inbox.

In addition to the four PoE camera ports, the GEVA 400 includes Ethernet and serial ports for communicating with third-party devices, four USB ports for setup and run-time control, and a dedicated display. Vision solutions are setup using integrated iNspect or Sherlock software applications. iNspect software requires little or no prior vision experience, while Sherlock offers greater flexibility to tackle more challenging inspection tasks. Both software packages offer a wide selection of tools and capabilities for applications requiring positioning, identification, verification, measurement, and flaw detection.

 

Feature in a nutshell include:

  • Quad Core Atom @ 1.8 GHz
  • 4 GB program memory, 256 GB SSD storage          
  • 4 GigE camera ports with PoE
  • 2 GigE communication ports for third party interfacing         
  • 4 USB ports, 1 RS-232, VGA and HDMI for direct connect display with high resolution
  • 0-50°C fanless design
  • 55 x 145 x 198mm, DIN mount design
  • I/O support via external PL-USB
  • Win10 IoT Embedded 64-bit O/S with write filter protects drive image when power is lost
  • iNspect Express and Sherlock 64-bit software

  For more information, visit Teledyne DALSA.

Suggested Articles

Reports say Apple may incorporate 3D sensors on its next iPad Pro to add augmented reality features.

Tessent Connect from Mentor allows teams to work at a higher abstraction level than before

Zync system-on-chip devices are about one-fourth of all Xilinx revenues