Ultratech Introduces Superfast 4G+ Low-Cost In-Line Inspection System For Patterned Wafers

SAN JOSE, CA -- Ultratech, Inc. introduces the Superfast 4G+ in-line, 3D topography inspection system. Ultratech's new 4G+ system builds on the field leadership of the Superfast 4G, providing the industry's highest-productivity and lowest-cost solution for high-volume manufacturing. The Superfast 4G+ system's patented coherent gradient sensing (CGS) technology enables Ultratech customers to use a single type of wafer inspection tool to measure patterned wafers across the entire fab line at the lowest cost. Ultratech plans to begin shipping the Superfast 4G+ systems in the first quarter of 2016.

The Superfast 4G+ leads the industry with features including:
•Direct, front-side 3D topography measurement for opaque and transparent stacks patterned wafers
•150 wph, the highest industry 3D in-line inspection throughput with the smallest footprint
•1-mm edge exclusion enabling full-wafer pattern inspection and thin-film 3D process control
•Large bow option for in-line manufacturing control of highly bowed wafers without impacting throughput

Damon Tsai, Ultratech Asia Director for Inspection Systems, said, "Our current leadership position in in-line 3D inspection at advanced memory and foundry manufacturers with Superfast 4G has provided us with a tremendous learning environment. Our partners have helped us develop new hardware capabilities like the 'Recipe Driven Range Control,' an innovative high-throughput, large bow optical option on board the Superfast 4G+, as well as new fleet management performance metrics. The inherently simple design of the CGS technology is enabling us to rapidly deliver new capabilities and performance improvements over more complex optical solutions."

Ultratech's Superfast 4G+ Inspection System

Based on patented CGS technology, Ultratech's Superfast 4G+ inspection system provides the industry's highest throughput (150 wph) with the lowest cost-of-ownership compared to competing systems. The direct, front-side 3D topography measurement capability is well-suited for patterned wafer applications such as lithography feed-forward overlay distortion and edge-defocus control as well as thin-film deposition stress and planarization control. Delivering a 2X improvement in performance with fleet matching TMU (Total Measurement Uncertainty), along with the ability to measure opaque and transparent stacks on patterned wafers, the Superfast 4G+ provides cost-effective technology to address the critical needs of its global customers. In addition, leveraging the same breakthrough CGS optical module, the Superfast 4G+ is available as a field upgrade of the Superfast 4G.

For more info, go to http://www.ultratech.com
 

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