Ultrasonic Coating System for Photoresist Deposition Offers Unique Advantages

Sono-Tek ultrasonic atomization equipment has been used to coat semiconductor wafers with thin film coatings of photoresist since the 1980s. With the continued expansion of high aspect ratio MEMS and sensors manufacturing, Sono-Tek has seen a need for a complete coating system that can overcome the challenges of uniform coverage of photoresist onto wafers with deep trenches or difficult topography. The SPT200 was designed using customer feedback to specifically meet these unique challenges. The system replaces traditional spin coating techniques, providing more uniform coverage of side wall and corner deposition, with a fraction of the photoresist consumption. Ultrasonic spray is a well proven method for semiconductor lithography manufacturing used in hundreds of machines worldwide.

The new SPT200 system is a full coating solution, configured with Vortex or AccuMist ultrasonic spray shaping nozzles, depending upon coating requirements. At the heart of the system is Sono-Tek’s patented ultrasonic nozzle technology. These nozzles feature up to 90% reduction in material consumption, non-clogging performance, precise control of droplet size, and repeatable spray patterns at ultra-low flow rates.

SPT200 unique system features include:

· Automated spray coating with recipe storage
· Designed for 100, 150, 200, and 300mm wafers
· Precision temperature control
· Integrated wafer lockdown
· Simple manual operator load / unload design
· Highly repeatable photoresist delivery pump with automated refill
· Manual wafer load/unload
· Highly repeatable, stable process

For more info, visit http://www.sono-tek.com/photoresist-coating-system-for-semiconductor-lithography

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