Toshiba Debuts NAND Flash Memory Products for Embedded Applications

Devices Compatible with Serial Peripheral Interface

IRVINE, CA -- Toshiba America Electronic Components, Inc. unveils a new family of NAND flash memory products for embedded applications. Compatible with the widely used Serial Peripheral Interface (SPI), Toshiba's new Serial Interface NAND can be used in a wide range of consumer and industrial applications, including flat screen TVs, printers, wearable devices, and robots. The Serial Interface NAND family consists of 12 products; includes three densities (1 gigabit (Gb), 2 Gb and 4 Gb); two packages (WSON*1 and SOP*2); and two power supply voltages. Sample shipments start today, and mass production is scheduled to begin with the 1 Gb products in December 2015. Mass production of the remaining products will follow.

Due to its compatibility with the SPI, Toshiba's new product family can be controlled with just 6-pins, and can be utilized as an SLC NAND flash memory with a low pin count, small package and large capacity.

NOR flash memory is typically used in embedded applications for consumer and industrial devices. However, in order to support the new, enhanced features found in embedded devices, larger memory densities are needed in order to save software (including boot up programs, firmware and embedded OS) and data (including log data). Due to this, demand is increasing for SLC NAND flash memory based on its high density, high reliability and low bit cost when compared to NOR flash memory.

The new Serial Interface NAND product family is another example of Toshiba's strategic innovation and development to meet the wide ranging needs of the market - and expand the reach of NAND flash memory.

Key Features:

1.Uses 24nm process technology for SLC NAND
2.Compatible with the widely used SPI, which can be controlled with a low pin count of 6-pins
3.Available in small and versatile packages. The WSON package size is 6.0mm×8.0mm and the SOP package size is 10.3mm×7.5mm. Products in the BGA*3 package are also under development, with sample shipments scheduled for the first quarter (Jan.-Mar.) of 2016. The packages and the pin assignments are compatible with common serial flash memories.
4.Embedded ECC (Error Correction Code) with bit flip count report function
5.Embedded data protection features

For more information on Toshiba's Serial Interface NAND technology and other flash memory solutions, visit

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