Thermal Sensor Seeks Large-Volume Applications

Thermal Sensor Seeks Large-Volume Applications

Promoted as the first thermal sensor designed with a unique wafer-level packaging, the Micro80 Gen2TM targets high-volume applications. The sensor supports standardized interfaces such as I2C and HSync/VSync clocking and contains a series of improved characteristics that make for easy integration into assembly processes. It is allegedly the first Ball Grid Array (BGA) infrared sensor box packaged in a JEDEC tray, allowing it to support optical fields of up to 120°. It is also said to be the first infrared sensor with a unique plastic lens holder, eliminating the need for the user to develop its own, thus saving time and lowering costs. Other features include a power consumption of less than 55 mW, an operating temperature range from -40°C to +85°C), support for a frame rates from 1Hz to 50 Hz, and a vision range up to 150m. For more details, go to

Veurey-Voroize, France
+33 4 76 53 74 70

Contact Info

Company: ULIS
Country: France
Phone number: +33 (0)4-76-53-74-70
Fax: +33 4-76-53-74-80

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