Spansion Introduces HyperRAM Memory

SUNNYVALE, CA -- Spansion Inc. announces the first RAM device with the HyperBus interface. The Spansion HyperRAM memory, a companion to HyperFlash memory, enables a simple and cost-effective solution for SoCs and microcontrollers (MCU), where both the flash and RAM are connected on the same 12-pin HyperBus interface. With a read throughput up to 333 megabytes-per-second, the HyperBus devices enable fast boot, graphics display and real-time XIP applications.

"Momentum continues to build for our HyperBus interface with many chipset suppliers adopting this high-performance solution. The addition of HyperRAM memory is a natural step in the evolution of the HyperBus interface and a perfect companion device to HyperFlash memory," said Jackson Huang, vice president of product marketing and ecosystem at Spansion. "HyperRAM memory is ideal for SoCs with limited RAM and provides a scalable solution for extending fast read and write operations externally, allowing fast delivery of high-resolution graphics in the early part of the boot process for automotive, industrial and IoT applications. It also minimizes the number of pins that would normally be required to support standard DRAM, resulting in reduced PCB complexity and cost."

Spansion HyperRAM memory can operate at frequencies as fast as 166MHz in DDR mode with a fast, random initial access time of 36ns. Faster read access means less compressed, higher resolution graphics can be read, resulting in a sharper display. The combination of HyperFlash and HyperRAM enables simpler board designs and software development, thus enabling faster time to market. Applications which can take advantage of these benefits include automotive instrument clusters, infotainment, navigation systems, advanced driver assistance systems (ADAS), digital cameras, projectors, factory automation, medical equipment, home automation and appliances, hand-held and other IOT devices.

Availability

Spansion 64Mb HyperRAM will be sampling in the second quarter of 2015. It will be available in both 3V and 1.8V versions packaged in the market compatible 5x5 array BGA.

For more details, visit:
• Spansion HyperRAM Overview SlideShare presentation: https://www.slideshare.net/Spansion/spansion-hyper-ram-presentation
• Spansion HyperFlash Memory Photos: http://news.spansion.com/image_gallery
• Spansion HyperBus and HyperFlash Overview SlideShare presentation: http://www.slideshare.net/Spansion/spansion-hyper-bus-interface
• Spansion newsroom: http://news.spansion.com

For more information, visit http://www.spansion.com

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