Single-Chip Balun Eliminates Antenna Circuitry

STMicroelectronics offers a matched balun for its S2-LP 868-927MHz low-power radio transceiver that promises to save board space and minimize RF-circuit design challenges. The 3.26-mm2 BALF-SPI2-01D3 integrates all the impedance-matching and filtering components needed to connect an antenna to the S2-LP radio, replacing a conventional network of 16 discrete capacitors and inductors that can occupy up to 100 mm2 of board real-estate. Essentially, this translates into a footprint reduction of more than 96%.

 

Additionally, circuit design is greatly simplified, with no need to select component values or tackle exacting layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance. The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1 mm x 1.55 mm chip-scale package (CSP), priced from $0.176 each/500. Should you be clamoring for more specs, a BALF-SPI2-01D3 datasheet is available for you learning pleasure.

Sponsored by Infosys

Infosys positioned as a Leader in Gartner Magic Quadrant for IT Services for Communications Service Providers, Worldwide 2020

The Gartner Magic Quadrant evaluated 12 vendors and Infosys was recognized for its completeness of vision and ability to execute.
Infosys leverages its global partner ecosystem, CSP-dedicated studio, design tools, and 5G Living Labs to boost service delivery. Innovative solutions such as the ‘Infosys Cortex2’ are driving business value for CSPs.

 

STMicroelectronics

Burlington, MA

781-861-2650

http://www.st.com

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