Silicone Potting/Encapsulating Compound Adds Little Weight To End Product

Silicone Potting/Encapsulating Compound Adds Little Weight To End Product
Epoxies Etc.

When adding less weight to electronic assemblies is an important consideration, the 20-1634 silicone-potting compound is reportedly less than half the weight of most commercially available potting and encapsulating compounds. It relies on advanced micro balloon technology fillers to achieve a specific gravity of 0.82. Many filled potting compounds can have specific gravities of 2.0 or higher. The 20-1634 is also formulated without solvents or other toxic materials. More details are available at http://www.epoxies.com/_resources/common/userfiles/file/20-1634R.pdf

Epoxies Etc.
Cranston, RI
401-946-5564
[email protected]
http://www.epoxies.com

Contact Info

Company: Epoxies Etc.
Country: United States (USA)
Phone number: 401-946-5564
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