Sensors Expo 2018: Turn-Key Solutions For MEMS Sensors

SMART Microsystems has the ways, means, and flexible equipment capabilities to create a turn-key solution for microelectronic package assembly of MEMS sensors. The company can help reduce total costs from prototyping through market entry.


Prototype development and manufacturing capabilities include dicing, die attach/flip chip, vacuum solder reflow, wire bonding, and encapsulation.  Their environmental life testing identifies reliability issues early in MEMS sensor product development.  Additionally, the company can build early proof-of-concept samples as well as feasibility studies to help avoid challenges that appear early in process development. 

Free Newsletter

Like this article? Subscribe to FierceSensors!

The sensors industry is constantly changing as innovation runs the market’s trends. FierceSensors subscribers rely on our suite of newsletters as their must-read source for the latest news, developments and analysis impacting their world. Register today to get sensors news and updates delivered right to your inbox.


In brief, SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements.


Visit SMART Microsystems in Booth 340 at Sensors Expo & Conference, June 26 to 28, 2018 in San Jose, CA.


SMART Microsystems Ltd.

Elyria, OH 





Suggested Articles

IP theft and technology transfer are key components of eight-part deal

According to a Gartner report, global semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018.

3D printed prosthetic arm has Arm M4 processor inside on board built by Particle