Sensors Expo 2018: Turn-Key Solutions For MEMS Sensors

SMART Microsystems has the ways, means, and flexible equipment capabilities to create a turn-key solution for microelectronic package assembly of MEMS sensors. The company can help reduce total costs from prototyping through market entry.

 

Prototype development and manufacturing capabilities include dicing, die attach/flip chip, vacuum solder reflow, wire bonding, and encapsulation.  Their environmental life testing identifies reliability issues early in MEMS sensor product development.  Additionally, the company can build early proof-of-concept samples as well as feasibility studies to help avoid challenges that appear early in process development. 

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In brief, SMART Microsystems creates turn-key solutions for microelectronic package assembly challenges to move MEMS sensor technology from development to production. With an engineering team experienced in manufacturing and state-of-the-art facilities, SMART Microsystems accelerates the transition of new MEMS sensor products to market, providing the lowest overall development time and cost to satisfy full life cycle requirements.

 

Visit SMART Microsystems in Booth 340 at Sensors Expo & Conference, June 26 to 28, 2018 in San Jose, CA.

 

SMART Microsystems Ltd.

Elyria, OH 

440-366-4203

http://www.smartmicrosystems.com

 

 

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