Sensors Expo 2018: Multiple Ways to Success With MEMS Pressure Sensor Technologies

The MEMS pressure sensor market is still driven by automotive applications. Established automotive applications increase MEMS pressure sensors adoption in the integrating systems, and also widespread their geographical adoption especially in China thanks to new automotive regulation. Consumer is the second pressure sensor business with new consumer applications including wearables, electronic cigarette, drones… which are giving attractive perspectives to the devices’ manufacturers.

MEMS pressure sensor technologies are basically segmented into piezoresistive and capacitive categories. Both two technologies are not hugely different in terms of performance but capacitive is limited to absolute pressure applications. Today piezoresistive is leading the industry in terms of market share, and that will probably continue in the future despite growing adoption of capacitive technology in consumer application.

To complement Yole Développement (Yole) technology & market report, MEMS Pressure Sensor Market and Technologies 2018, System Plus Consulting, part of Yole Group of Companies, has conducted a unique comparative review of pressure sensors chips, modules and TPMS.
Under this new MEMS Pressure Sensor Comparison 2018 report, the reverse engineering & costing company provides insights into the structures, technical choices, designs, processes, supply chain positions and costs of a selection of key MEMS pressure sensors. 7 consumer, 14 industrial and 13 automotive MEMS pressure sensor products from the leading suppliers are so deeply analyzed in System Plus Consulting’s study. Suppliers include All Sensors, Amphenol, APM, Bosch, Denso, First Sensor, Fuji Electric, Freescale/NXP, Honeywell, Infineon, Melexis, Merit SensorSystems, Mitsubishi Electric, Nagano Keiki, Sensata, Sensirion, SMI and STMicroelectronics.
 

The MEMS pressure sensors comparison from System Plus Consulting points out the diversity of devices and related technologies, which are a characteristic of this industry. All manufacturing process flows and cost reviews are detailed in this report to highlight the technical choices made by each player, according to the market segments.

Analysts compare the devices that use piezoresistive or capacitive technology, manufactured with bulk micromachining or surface micromachining processes, first level packaging or module packaging, monolithic or multi-chip structures. The team looks at their package dimensions and internal structures, MEMS and ASIC dies, die dimensions and package cross-sections, to provide a comprehensive review of MEMS pressure sensors. A detailed description of System Plus Consulting report is available: Here.

System Plus Consulting and Yole’s team will attend a selection of MEMS & Sensors conferences during the next few months. Save the following date in your agenda.