LINZ, Austria /BUSINESS WIRE/ -- Nanoident Technologies AG, a world leader in printed semiconductor-based optoelectronic sensors, announced the Nanoident Semiconductor 2.0 platform, the core technology foundation for a wide array of application-specific printed semiconductor platforms and products. The Semiconductor 2.0 platform enables the realization of a new class of printed semiconductor-based electronic devices with unique technical features for applications in a wide range of markets, including consumer, industrial, life science, and security.
"We see an incredible opportunity for our groundbreaking technology. More and more market leaders are recognizing the tremendous capabilities of printed electronics to enable new innovative products with unique selling propositions," said Klaus G. Schroeter, CEO, Nanoident.
Nanoident's Semiconductor 2.0 platform is the core technology for all Nanoident vertical market platforms and is comprised of four core intellectual property (IP) elements, which include liquid conductive and semiconductive materials IP, design and simulation IP, production processes and quality assurance IP, and functional component IP. The Semiconductor 2.0 platform enables the design and mass production of printed semiconductor-based functional components, such as photo detectors, light emitting diodes, transistors, photovoltaic cells, resistors, capacitors and interconnects.
To enable the rapid deployment of printed semiconductor-based products in specific vertical market segments, Nanoident and its market-focused subsidiaries have created additional vertical market platforms for the life science and security markets, the PhotonicLab platform and the SmartBiometrics platform. These platforms are based on the Nanoident Semiconductor 2.0 platform technology and are used to create a vast array of custom-specific printed semiconductor devices for the life science and security markets, such as optoelectronic sensors, chemical and biological sensors, biometric sensors, X-ray detectors, and lab-on-a-chip systems. In the future, the platform will also enable printed OLED displays, transistors, and integrated circuits, or a combination of these functions in a single device.
Analysts forecast that the printed semiconductor market is expected to grow to more than $300 billion by 2025 (Source: IDTechEx). Because devices are produced using liquid conductive and semiconductive materials, Nanoident makes it possible to print electronic circuits on a wide variety of surfaces using advanced printing systems. This process delivers devices with a vast array of unique technical features and substantial cost and time savings. Printed semiconductor devices based on Nanoident's Semiconductor 2.0 platform technology can be flexible, ultra-thin, low weight, and very large (several square meters), opening up new application areas not accessible with conventional silicon-based technologies. With Nanoident's new printed semiconductor production process, devices can also be manufactured in hours rather than weeks.
Printed semiconductor devices based on Nanoident's Semiconductor 2.0 platform are highly customized and sold directly to global OEM partners. For more information about Nanoident and the Semicondcutor 2.0 platform, please visit the company's Web site.
About Nanoident Technologies AG
Nanoident is the world leader in the development and manufacture of printed semiconductor-based optoelectronic sensors. The company's core technology merges the latest breakthroughs in materials science and nanotechnology with modern printing techniques to create a new class of semiconductor devices. The revolutionary Semiconductor 2.0 platform is the basis of the world's first commercial printed photonic sensors, enabling a whole new generation of applications in the industrial, biometric, and life science markets.
Nanoident's high-speed, environmentally friendly manufacturing process uses liquid nanomaterials and additive production techniques. These liquids are used to print electronic circuits on a wide variety of surfaces, producing products in mere hours for prototype, as well as high-volume applications. The company's printed semiconductor devices can be bendable, disposable, light, ultra-thin and large area. They have application-specific spectral and electronic properties and can contain light sources and light detectors, as well as electronic circuits. These unique characteristics enable cost-effective, custom-designed devices for applications such as industrial, chemical, biological, biometric, and X-ray sensors and printed OLED displays for smart packaging and electronic signage.
Privately held, the company is headquartered in Linz, Austria, with subsidiaries in Menlo Park, CA, and Grenoble, France.