Reworkable Underfill Enhances IC Thermal Cycling

Reworkable Underfill Enhances IC Thermal Cycling
Zymet Inc.

Promising to enhance the thermal cycle performance of IC packages with pitches as fine as 0.3-mm, the CN-1735 board-level reworkable underfill also offers extended ruggedness for drop and bend test performance. CN-1735 has a CTE of 40 ppm/°C and reworks easily under higher temperatures from +170°C to +180°C. Underfill residue scrapes off easily, again at +170°C to +180°C. For more info, visit 

Zymet Inc.
East Hanover, NJ.
[email protected] 

Contact Info

Company: Zymet Inc.
Country: United States (USA)

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