Zymet Inc.
Promising to enhance the thermal cycle performance of IC packages with pitches as fine as 0.3-mm, the CN-1735 board-level reworkable underfill also offers extended ruggedness for drop and bend test performance. CN-1735 has a CTE of 40 ppm/°C and reworks easily under higher temperatures from +170°C to +180°C. Underfill residue scrapes off easily, again at +170°C to +180°C. For more info, visit http://www.zymet.com/p-rework-underfill.php
Zymet Inc.
East Hanover, NJ.
973-428-5245
[email protected]
http://www.zymet.com
Contact Info
Company:
Zymet Inc.
Country:
United States (USA)