Norwood, MA -- Remtec Inc. expands its LED substrate and submount design and manufacturing capabilities by adding new features such as bond-pad down (flip-chip) packaging with a cathode-anode gap as small as 75-50 µm and selective gold-tin plating. As a result, Remtec can now produce higher performance, lower cost metallized LED substrates and submounts using added benefits, each custom tailored to a specific customer requirement matching the required performance and power level or assembly methods.
Remtec LED substrates and submounts utilize a variety of metallization technologies on alumina, AIN and BeO ceramics: PCTF® (Plated Copper on Thick and Thin Film) with 20-75 µm copper, AgENIG® (Electroless Nickel and Immersion Gold over Silver) and DBC (Direct Bond Copper) with 125-250 µm copper.
Remtec has developed LED substrates for bond-pad down devices allowing “narrow gap” capability for 50 µm wide gaps suitable for InGaN, GaAs and other LED devices. It enables direct eutectic die-attach, eliminating the need for wire bonds and ensures superior thermal and electrical performance for the next generation of solid-state LED devices.
Remtec’s lower cost, high performance gold tin plating that is selectively applied over basic metallization eliminates bulky solder preforms and ensures void-free solder joints in LED substrates and submounts.
Finally, using these new capabilities and refined manufacturing techniques, Remtec is able to offer LED assembly manufacturers reliable solutions, competitive pricing, low upfront tooling costs and fast turnaround times without any compromise in quality or performance.
In addition to traditional LED lighting markets, Remtec is expanding LED substrates and submounts for non-invasive medical diagnostics, dental, printing and other industries requiring enhanced light extraction from LED chips.
Remtec, a RoHS compliant, ISO 9001:2008 registered and ITAR compliant company, operates a manufacturing facility totaling 33,000 sq. ft. in Norwood, MA. Remtec provides custom and semi-custom packaging solutions for RF/MW products, DC power electronics, optoelectronics and other high density circuitry in commercial, industrial and military industries.