Redundant Sensor Architecture Supports ASIL D Systems

Redundant Sensor Architecture Supports ASIL D Systems
Infineon Technologies North America Corp.

According Infineon Technologies, its dual-sensor package will be only one sensor chip in future. Offering two families of linear Hall sensors and angle sensors in the dual-sensor package, the packaging technology supports ASIL D systems and reduces physical space requirements and system cost. By using a unique stack-mounting technology, the devices of the linear Hall sensor and angle sensor families combine two independent sensors within standard PG-TDSO packages measuring about 1-mm in thickness. Essentially, this approach stacks two sensors within a patented flip-chip technique. The dimensions of the PG-TDSO-8 package for linear Hall sensors are identical to the footprint of single sensor devices measuring 4 mm x 5 mm x 1.2 mm. Angle sensors, both with GMR and AMR technology, are also available in PG-TDSO-16 packages. All sensors in dual-sensor packages are specified for a temperature range of -40 °C to 125 °C and automotive qualified. For more details, visit and at

Infineon Technologies Corp.
Milpitas, CA

Contact Info

Company: Infineon Technologies North America Corp.
Phone number: 866-951-9519

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