Plating Technique Enables Cost-Effective High Frequency PCBs

Plating Technique Enables Cost-Effective High Frequency PCBs

Remtec now employs its Gold-Tin Plating Technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and Microwave electronic components, lead frames, and other miniature parts on high-frequency printed-circuit boards (PCBs). The proprietary new process replaces the commonly used, labor-intensive method of placing and fastening gold tin solder performs on organic boards. For more details, visit

Remtec Inc.
Norwood, MA
[email protected]

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