Irvine, CA --- Innovators at Integra Devices and the University of California Irvine (UCI) are commercializing a revolutionary new way to build microelectronic devices and sensors. Based on over 15 years and millions of dollars of research at UCI, this manufacturing process will transform the marketplace with smaller, cheaper and faster solutions. Integra Devices is producing a new breed of 5G RF devices and smart IoT edge products.
The emerging Internet of Things (IoT) market is creating demand for billions of devices that sense the environment and send information to the internet. This creates unique challenges for the telecommunication, information technology (IT), and semiconductor industries. The wireless communications infrastructure must upgrade to over 28 GHz (5G) to accommodate the explosion in data. The IT industry must determine how to install and connect billions of devices to existing equipment and infrastructure. The semiconductor industry must develop new, small, low cost, highly integrated sensing devices.
Conventional semiconductor and MEMS manufacturing processes have inherent limitations for building sensors and high frequency RF devices. This industry has miniaturized less than 10% of the overall sensor market in the last 30 years, and has had very limited success in developing miniature RF/Microwave devices for high frequency, making it very difficult to cost effectively deliver for IoT and 5G.
Integra Devices provides a powerful new manufacturing paradigm that can build next generationRF and sensing products without the drawbacks of conventional microelectronic manufacturing, at a fraction of the cost. Furthermore, the Integra Devices approach significantly reduces the cost and time to innovate, design and manufacture these devices. Integra Devices is currently preparing products mm-wave devices, zero-power sensing devices, and smart edge devices.
For more information visit http://www.integradevices.com