TE Connectivity's latest Octal Small Form Factor Pluggable (OSFP) connector and cable assembly portfolio supports next-generation data centers delivering data rates of 200 Gbps and 400 Gbps. The components are designed to support 8x28G NRZ and 8x56G PAM-4 protocols, with a roadmap to 8x112G PAM-4 for future system upgrades.
The OSFP connectors leverage thermal heat sink technology to provide reliable thermal performance and the signal integrity that 400 Gbps data rates require. They can fit up to 36 400G ports into a 1RU switch form factor, aligned with next-generation switch silicon roadmaps. The OSFP portfolio includes surface mount connectors, 1x1 and 1x4 cages, and straight and breakout passive copper cable assemblies in multiple configurations and various lengths and gauges. To learn more, visit TE CONNECTIVITY.