Orbotech Enters Solder Mask Direct Imaging Segment with a New Family of Direct Imaging Solutions

YAVNE, Israel -- ORBOTECH LTD. introduces a new family of Direct Imaging (DI) solutions for Printed Circuit Board (PCB) solder masks. Direct Imaging, one of the methods utilized in imaging solder mask layers, is an increasingly important segment, which Orbotech currently estimates to between $70M - $90M per annum. Orbotech's new solutions, which include the Orbotech Diamond™ and the Nuvogo™ 1000, are expected to accelerate and increase the overall quality and efficiency of PCB solder mask production processes. The Orbotech Diamond DI system addresses the solder mask manufacturing needs of the High Density Interconnect (HDI) and Multilayer board (MLB) segments of the PCB industry by offering high power and throughput. Beta site testing by three different customers in diverse geographical regions has resulted in orders from all three PCB manufacturers. The Orbotech Nuvogo 1000 joins the field proven Nuvogo family of products and brings high accuracy and industry leading Depth of Focus (DoF) to flexible PCB solder mask and other precision applications.

"With the demand for smaller, sleeker and wearable electronics, today's manufacturers require PCB flexible production solutions that enable them to produce compact, high-quality and low-cost PCBs with multiple competitive features in quick turnaround conditions" said Mr. Arik Gordon, Corporate Vice President and President of the PCB Division at Orbotech Ltd. "Our new solder mask DI systems offer PCB manufacturers effective tools that deliver high throughput and streamlined production by enabling a unified workflow and a consistent user interface from patterning to solder mask, advancing the quality of PCB volume production and ultimately increasing overall production yield."

Orbotech Solder Mask DI Solutions

Orbotech's DI systems are specially designed to handle the most challenging PCB production applications. Most of the world's high-end PCBs used in smartphones are already produced using Orbotech systems; and the new products announced today will introduce even greater functionality to Orbotech's portfolio of DI systems. Throughput enhancement features include a dual table mechanism for imaging speed optimization and flexible scaling modes to ensure exceptional registration.

Orbotech Diamond DI Solution
•Utilizes high power light source for maximum throughput for common solder resist.
•Wide wavelength spectrums that further ensure best fit for conventional solder resists.

Nuvogo 1000 DI Solution
•High Depth of Focus (DoF) for highest line quality on challenging topographies
•MultiWave Laser Technology simultaneously generates a dual wavelength beam for maximum robustness on a wide range of solder and patterning resists.
•Fits demanding application such as Solder resist for Flex, and allows dual use for patterning and SR exposure.

For more information, visit http://www.orbotech.com
 

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