The 20-3213 one component heat cure epoxy system is designed for electronic applications requiring reliable dielectric properties. No weighing and mixing are required. The epoxy is low in viscosity (3,000 cps), allowing for easy flow and quick processing. It can be used as an impregnating compound in electrical laminations, a potting compound, and an underfill encapsulant. Once cured, the epoxy provides moisture protection and electrical insulation properties. A packaging option for the 20-3213 is pre-filled 10, 30, or 55cc syringes. One and five gallon bulk packaging is also available. More information is available at http://www.epoxies.com/_resources/common/userfiles/file/20-3213.pdf
One Component Epoxy Fortifies Electronic Designs
Company: Epoxies Etc.
Country: United States (USA)
Phone number: 401-946-5564
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