NXP and Nepes Deliver Their First FO PoP SiP for IoT

Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its 7% CAGR between 2016 and 2022 (in revenues) is undoubtedly a dynamic sector where innovations play a key role.


NXP’s SCM-i.MX6Q FO PoP SiP with boot memory and power management is a good illustration of the evolution of advanced packaging platforms. Therefore, NXP proposes a simple but smart combination of SiP and PoP integration with very small form factor for IoT applications. NXP’s module has been initially developed for simple IoT applications. However, tomorrow, this SiP approach might be intended to high-end market segments.

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Fully dedicated to IoT applications, NXP’s module includes the i.MX6-Quad application processor, MMPF0100 power management system, a 16MB Flash memory and about 100 surface mounted devices, all in a single package smaller than 200 mm3.

“This is the first multi die fan-out device than we have found in the market, and could be a key milestone for fan-out SiP technology,” asserts Stéphane Elisabeth, Advanced Packaging & RF Cost Engineer at System Plus Consulting.


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