REHOVOT, Israel --- Nova Measuring Instruments introduces a new hybrid metrology concept, which combines measurements from two of its leading metrology platforms - X-Ray and Optical.
With this newly introduced solution, thin film and material parameters (measured on X-Ray metrology platforms) are combined with profile and geometry parameters (measured on Optical CD metrology platforms) for better process control in the most advanced technology nodes. This unique offering utilizes the synergy between the technologies, resulting in superior metrology performance that supports tighter process control schemes for faster time to market. The new hybrid solution relies on Nova's novel optical and X-Ray modeling algorithms and is being evaluated by several key customers.
Additional information may be found at http://www.novameasuring.com