TE Connectivity's next-generation 0.8-mm free height board-to-board connectors achieve what may be considered unrivaled speeds of 32 Gb/s and higher. The mid-density mezzanine components are 56 Gb/s PAM-4 and PCIe Gen 5 capable for future upgrades. They also deliver higher reliability through a stronger plug/receptacle mechanical design, maintaining the same performance when de-mated up to 0.5 mm. In addition, modular tooling enables 1mm stack height increments and flexible pin counts.
"Our engineers continually find ways to deliver higher-performing connectivity products, and our next-generation free height connectors are just the latest example," said Lily Zhang, product manager at TE Connectivity. "With these new connectors, we deliver excellent price/performance in a future-proof product." Need to learn more? Checkout the height connectors product and applications page. Also visit TE Connectivity.