Touted as the smallest thermal profiling system designed specifically for miniature wave selective soldering processes, the DATAPAQ SelectivePaq uses four thermocouples to take measurements from the electronic assembly as it passes through the preheating and dip soldering phases. Sample intervals can be adjusted to up to 20 times per second. The detailed temperature profiles enable electronics manufacturers to adjust their operations for optimum efficiency, validate the consistent quality of PCBs to customers, and prove adherence to both solder and component temperature constraints.
The profiling system combines a new four-channel DATAPAQ Q18 micro data logger with the latest micro-miniature thermocouple plugs and a low-mass thermal shield merely 20 mm high and 40 mm wide. It is therefore optimally suited to monitor the performance of machines that offer very restricted space and for use with holding frames. The complementary DATAPAQ Selective Soldering Process Sensor Array facilitates regular and frequent process stability measurements.
The logger provides a superior accuracy of ±0.5 °C and resolution of 0.1 °C. It connects up to three height-adjustable wave contact thermocouples and up to two preheat thermocouples for monitoring both process phases. The preheat thermocouples contain a top and a bottom sensor and are designed to work with IR and convection preheat technologies. The machined-from-solid aluminum logger case and user-replaceable rechargeable battery pack ensure a long operational life and lowest ownership costs. The system is supplied with the full DATAPAQ Insight Reflow software. Data analysis includes maximum slopes, maximum temperatures, and wave contact times. The software enables data export to other Windows-compatible programs.
For more information, please visit http://www.flukeprocessinstruments.com