Molex Solder on Polyester Substrate Delivers Flexible, Cost-effective Circuitry

LISLE, IL --- Molex has introduced Solder on Polyester Substrate, a flexible, economical alternative to rigid PCB and polyimide. Surface Mount (SMT) components, including fine-pitched integrated circuits (ICs) are attached with low-temperature solder and encapsulated on a polyester substrate. Custom designed products can be used for capacitive touch buttons, capacitive fluid level sensors and membrane switches in a broad range of consumer, medical and industrial applications.

By allowing smaller components with tighter pitches, the Solder on Polyester Substrate delivers higher yields and reduces costs. To ensure a robust connection, solder joints are protected by UV-cured encapsulant, enabling them to withstand vibration and mechanical shock. In addition, right-angle LEDs can be attached to enhance backlighting for user-interface applications. The flexible substrate is available in clear, translucent or white. Typical thicknesses are 0.13 and 0.18mm.

For more information about Solder on Polyester Substrate from Molex, visit http://www.molex.com
 

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