Microporous Copper Foam Handles Heat Sink Duties

Microporous Copper Foam Handles Heat Sink Duties
Goodfellow Corp.

Copper foam with pore sizes between 300 and 600 µm and a relative density of around 37% provides a much higher surface area than traditional copper foams. Therefore it is highly viable for use in designs requiring reliable heat exchange. Applications include liquid cooling, air cooling, heat exchangers, board-level electronics cooling, power electronics, and EMI shielding. Microporous copper foam is unique in that it is produced by means of a lost carbonate sintering process. Pure copper powder is mixed with a carbonate powder, compacted and sintered. This forms a matrix of copper ligaments, in between which is the carbonate powder. After cooling, the carbonate is dissolved away in water and recycled or decomposed using heat. The resulting structure is regular and uniform throughout, giving a rigid, highly porous and permeable structure with a controlled density of metal per unit volume. Microporous copper foam as disks and sheets ranging in thickness from 4 to 10 mm are available. Other thicknesses may be available upon request.

Goodfellow Corp.
Coraopolis, PA
[email protected]

Contact Info

Company: Goodfellow Corp.
Country: United States (USA)

Suggested Articles

Video "experience" service by Revl doesn’t rely on an AI chip

Nvidia saw its stock drop by 16% from its high a week ago

AMD and Nvidia saw 6% drop, joining long list of losers